MCP (Multiple Chip Package) memory, MCP is a plastic package housing, vertical stacking of various types of memory or non-memory chips of different sizes, is a hybrid technology of a single package, using this method to save small printed circuit boards PCB space....
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Memory module (Memory Module) refers to a printed circuit board with inlaid several memory chips on the surface, and the memory chips are usually DRAM chips. Memory modules are designed for a wide range of applications to provide optimum performance with low power requirements....
Universal Flash Storage, we can regard it as an advanced version of eMMC, is an array storage module composed of multiple flash memory chips, master control, and cache. UFS makes up for the defect that eMMC only supports half-duplex operation (read and write must be performed separately), and can achieve full-duplex operation, so the performance can be doubled....