The increase in the capacity of NAND flash memory, on the one hand, is to pack more bits in each unit (SLC/MLC/TLC/QLC...), on the other hand, it is 3D three-dimensional multilayer stacking. Now many SSD solid state drives use Both are 64-layer flash memory.

At the huge International Storage Working Group (IMW) meeting in Japan, Applied Materials (Applied Materials) proposed that by 2020, 3D flash memory stacking can achieve 120 layers or even higher, and 140+ layers in 2021. More than twice the current mainstream 64-layer.

However, with such a large number of flash memory layers stacked together, the requirements for manufacturing processes and materials will be very high, especially the 140-layer stack must use new basic materials.

3D flash memory will reach 140 layers in 2021: xTB SSD will become popular soon


Applied materials proposed that 90+-layer stacked flash memory will explode this year, and the overall stack thickness will increase to 5.5 microns, and the thickness of each pair of stacked layers will be reduced from 60nm to 55nm, thus ensuring the stability of the stack height.

With 140+ layers, the stack thickness will increase to about 8 microns, and each pair of stacked layers must be compressed to 45-50nm.

I believe that by then, TB-level solid state drives can be popularized in ordinary people's homes.

3D flash memory will reach 140 layers in 2021: xTB SSD will become popular soon


At present, SK Hynix has mass-produced 72-layer stacked 3D flash memory, while Western Digital and Toshiba are the first to achieve 96-layer, but they have not yet mass-produced and no actual products.

As for who can be the first to achieve 140-layer stacking, it remains to be seen.